{"title":"半导体器件中的静电放电:电路保护技术概述","authors":"J. Vinson, J. Liou","doi":"10.1109/HKEDM.2000.904204","DOIUrl":null,"url":null,"abstract":"Electrostatic discharges (ESD) are prevalent. These events damage sensitive electronic components causing system failures. Designers are not helpless against this event. There are ways to provide protection for these electronic devices. This paper provides an overview of the additional elements placed on the circuit to divert charge and clamp voltages. Both the protection architectures and clamps used are reviewed.","PeriodicalId":178667,"journal":{"name":"Proceedings 2000 IEEE Hong Kong Electron Devices Meeting (Cat. No.00TH8503)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Electrostatic discharge in semiconductor devices: overview of circuit protection techniques\",\"authors\":\"J. Vinson, J. Liou\",\"doi\":\"10.1109/HKEDM.2000.904204\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electrostatic discharges (ESD) are prevalent. These events damage sensitive electronic components causing system failures. Designers are not helpless against this event. There are ways to provide protection for these electronic devices. This paper provides an overview of the additional elements placed on the circuit to divert charge and clamp voltages. Both the protection architectures and clamps used are reviewed.\",\"PeriodicalId\":178667,\"journal\":{\"name\":\"Proceedings 2000 IEEE Hong Kong Electron Devices Meeting (Cat. No.00TH8503)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-24\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 2000 IEEE Hong Kong Electron Devices Meeting (Cat. No.00TH8503)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HKEDM.2000.904204\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 2000 IEEE Hong Kong Electron Devices Meeting (Cat. No.00TH8503)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HKEDM.2000.904204","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrostatic discharge in semiconductor devices: overview of circuit protection techniques
Electrostatic discharges (ESD) are prevalent. These events damage sensitive electronic components causing system failures. Designers are not helpless against this event. There are ways to provide protection for these electronic devices. This paper provides an overview of the additional elements placed on the circuit to divert charge and clamp voltages. Both the protection architectures and clamps used are reviewed.