基于灵敏度的全芯片衬底噪声分析建模和方法

R. Murgai, S. Reddy, T. Miyoshi, T. Horie, M. Tahoori
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引用次数: 10

摘要

基片噪声是混合信号设计中的一个重要问题。随着设计复杂性的增加,不可能使用详细的SPICE模型对每个晶体管使用精确的模型来模拟SN。在本文中,我们提出了一种基于灵敏度分析和静态时序分析的方法,以推导出计算设计中最坏情况下衬底噪声的简化模型。简化后的模型只包含很少的无源元件,而且仿真速度很快。我们的方法的主要特点是,与以前的方法不同,它独立于输入模式,不需要模拟数百万个时钟周期。这使我们能够在合理的CPU时间内将其应用于全芯片设计。我们在几个基准电路上对一个详细和高度精确的参考模型验证了我们的简化模型。平均而言,简化后的模型与参考模型的误差在16.4%以内,速度提高了38倍。最后,我们将我们的方法应用于由800万个门组成的混合信号开关芯片设计,并表明它在17分钟内完成。
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Sensitivity-based modeling and methodology for full-chip substrate noise analysis
Substrate noise (SN) is an important problem in mixed-signal designs. With increasing design complexity, it is not possible to simulate for SN with a detailed SPICE model that uses an accurate model for each transistor. In this paper, we propose a sensitivity analysis- and static timing analysis-based methodology to derive a reduced model that computes the worst case substrate noise in the design. The reduced model contains only passive components, which are very few, and is very quick to simulate. The main feature of our methodology is that, unlike previous approaches, it is independent of input patterns and does not need to simulate for millions of clock cycles. This lets us apply it to a full-chip design in reasonable CPU time. We validate our reduced model on several benchmark circuits against a detailed and highly accurate reference model. On average, the reduced model is within 16.4% of the reference model and is up to 38 times faster. Finally, we apply our methodology to a mixed-signal switch chip design consisting of 8 million gates and show that it finishes in 17 minutes.
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