{"title":"空接口微波无源RFID标签的批量CMOS","authors":"Y. Choi, W. Yeoh","doi":"10.1109/RFIT.2005.1598875","DOIUrl":null,"url":null,"abstract":"Overcoming the price hurdle that hampers mass-scale RFID adoption, this paper examines the architectural trade-offs as well as design issues involved in the development of a passive RFID tag IC targeted for low cost high volume deployment. Peculiar air-interfacing problems related to power rectification, data demodulation and backscattering modulation are addressed through the discussion of a design example whereby a 2.45-GHz RFID tag IC has been implemented in standard CMOS process.","PeriodicalId":337918,"journal":{"name":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Air-interfacing microwave passive RFID tag in bulk CMOS\",\"authors\":\"Y. Choi, W. Yeoh\",\"doi\":\"10.1109/RFIT.2005.1598875\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Overcoming the price hurdle that hampers mass-scale RFID adoption, this paper examines the architectural trade-offs as well as design issues involved in the development of a passive RFID tag IC targeted for low cost high volume deployment. Peculiar air-interfacing problems related to power rectification, data demodulation and backscattering modulation are addressed through the discussion of a design example whereby a 2.45-GHz RFID tag IC has been implemented in standard CMOS process.\",\"PeriodicalId\":337918,\"journal\":{\"name\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RFIT.2005.1598875\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International Wkshp on Radio-Frequency Integration Technology: Integrated Circuits for Wideband Comm & Wireless Sensor Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIT.2005.1598875","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Air-interfacing microwave passive RFID tag in bulk CMOS
Overcoming the price hurdle that hampers mass-scale RFID adoption, this paper examines the architectural trade-offs as well as design issues involved in the development of a passive RFID tag IC targeted for low cost high volume deployment. Peculiar air-interfacing problems related to power rectification, data demodulation and backscattering modulation are addressed through the discussion of a design example whereby a 2.45-GHz RFID tag IC has been implemented in standard CMOS process.
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