单栅极和双栅极工作模式下UTBB SOI mosfet不同接平面的影响

N. Othman, M. Arshad, S. Hashim
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引用次数: 7

摘要

在这项工作中,我们通过数值模拟研究了在单栅极(SG)和双栅极(DG)工作模式下,不同地平面对UTBB SOI mosfet的影响。对7 nm薄体(Tsi)和10 nm薄埋氧化物(TBOX)的10 nm栅极长度UTBB SOI MOSFET在Vd = 20 mV和1.0 V下进行了模拟。对于DG工作模式,后门(BG)和前门(FG)同时以10 mV的增量步长从0到1.5 V扫频。结果报告了关键器件参数,如阈值电压(Vth),漏极诱导势垒降低(DIBL),驱动电流(Ion),亚阈值摆幅(SS)和跨导(gm)。在通道下掺杂p+的地平面(GP) - B结构在DG工作模式下的DIBL和SS最低,但其Vth略高,而离子和gm的结果与其他GP结构相当。
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Impact of different ground planes of UTBB SOI MOSFETs under the single-gate (SG) and double-gate (DG) operation mode
In this work, we investigate the impact of different ground planes of UTBB SOI MOSFETs under the single-gate (SG) and double-gate (DG) operation modes by numerical simulations. Simulations were performed for 10 nm gate length UTBB SOI MOSFET of 7 nm thin body (Tsi) and 10 nm thin buried oxide (TBOX) for Vd = 20 mV and 1.0 V. For DG operation mode, the back-gate (BG) and front-gate (FG) were swept simultaneously from 0 to 1.5 V with 10 mV incremental steps. Results reported are on key device parameters such as the threshold voltage (Vth), drain induced barrier lowering (DIBL), drive current (Ion), subthreshold swing (SS) and transconductance (gm). Ground Plane (GP) - B structure which employed a p+ doping under the channel shows the best results under the DG operation mode in terms of the lowest DIBL and SS. However, it recorded a slightly higher Vth while the results of Ion and gm are comparable with its other GP counterparts.
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