芯片到芯片和背板通信的多级信令(教程)

A. Sheikholeslami
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引用次数: 10

摘要

芯片间和背板通信中的信号衰减随数据速率的增加而增加。根据信道的频率响应,如果采用多级信令而不是二进制信令,则可以减轻这种衰减。本文综述了二进制信令的基础知识,以及多级信令如何帮助提高信号质量。
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Multi-level Signaling for Chip-to-Chip and Backplane Communication (A Tutorial)
The signal attenuation in chip-to-chip and backplane communication increases with the data rate. Depending on the channel’s frequency response, this attenuation may be mitigated if multi-level signaling is employed instead of binary signaling. This paper reviews the basics of binary signaling and how multi-level signaling could help improve the signal quality.
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