{"title":"金属碳纳米管与铜未来VLSI纳米互连的比较","authors":"A. Maffucci, G. Miano, F. Villone","doi":"10.1109/SPI.2007.4512200","DOIUrl":null,"url":null,"abstract":"This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects\",\"authors\":\"A. Maffucci, G. Miano, F. Villone\",\"doi\":\"10.1109/SPI.2007.4512200\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.\",\"PeriodicalId\":206352,\"journal\":{\"name\":\"2007 IEEE Workshop on Signal Propagation on Interconnects\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-05-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Workshop on Signal Propagation on Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SPI.2007.4512200\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2007.4512200","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparison between metallic carbon nanotube and copper future VLSI nano-interconnects
This paper addresses the problem of scaling interconnects to nanometric dimensions in future VLSI applications. Traditional copper interconnects are compared to innovative ones made by bundles of metallic carbon nanotubes. A new model is presented to describe propagation along CNT bundles, in the framework of the classical transmission line theory. A possible future scaled CNT bundle microstrip is analyzed and compared to a conventional microstrip.
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