Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512253
D. Deschrijver, G. Antonini, T. Dhaene
The accurate computation of partial elements plays a key role in ensuring the accuracy and the stability of the Partial Element Equivalent Circuit (PEEC) method. Inaccuracies in partial elements computation, even at very high frequencies, may generate late time instabilities. On the other side, accurate computation of partial elements becomes prohibitively cumbersome when performed at high frequencies. In this paper a macro- modeling technique is applied, which is based on the use of frequency derivatives to allow a broadband characterization of electric and magnetic field couplings at a reduced computational cost.
{"title":"Fast calculation of PEEC macromodels using frequency derivatives","authors":"D. Deschrijver, G. Antonini, T. Dhaene","doi":"10.1109/SPI.2007.4512253","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512253","url":null,"abstract":"The accurate computation of partial elements plays a key role in ensuring the accuracy and the stability of the Partial Element Equivalent Circuit (PEEC) method. Inaccuracies in partial elements computation, even at very high frequencies, may generate late time instabilities. On the other side, accurate computation of partial elements becomes prohibitively cumbersome when performed at high frequencies. In this paper a macro- modeling technique is applied, which is based on the use of frequency derivatives to allow a broadband characterization of electric and magnetic field couplings at a reduced computational cost.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115140157","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512195
N. Terrassan, D. Bertozzi, A. Bogliolo
With the advent of nanoscale technologies, even RTL and system designers must consider interconnect analysis to provide predictable performance, reliability and meet power budgets. However, system-wide modeling of high-speed interconnects using conventional circuit simulators such as SPICE can become prohibitively CPU expensive. We propose to formulate analytical interconnect macromodels capturing noise effects, and to integrate them into the SystemC communication abstractions. Experimental results show that HDL simulations achieve an average accuracy of 5% from SPICE, while a few case studies illustrate the applicability of the proposed framework for fast exploration of physical channel configuration and performance estimation.
{"title":"Spice-accurate systemC macromodels of noisy on-chip communication channels","authors":"N. Terrassan, D. Bertozzi, A. Bogliolo","doi":"10.1109/SPI.2007.4512195","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512195","url":null,"abstract":"With the advent of nanoscale technologies, even RTL and system designers must consider interconnect analysis to provide predictable performance, reliability and meet power budgets. However, system-wide modeling of high-speed interconnects using conventional circuit simulators such as SPICE can become prohibitively CPU expensive. We propose to formulate analytical interconnect macromodels capturing noise effects, and to integrate them into the SystemC communication abstractions. Experimental results show that HDL simulations achieve an average accuracy of 5% from SPICE, while a few case studies illustrate the applicability of the proposed framework for fast exploration of physical channel configuration and performance estimation.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125438100","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512199
F. Ponchel, J. Legier, E. Paleczny, C. Seguinot, D. Deschacht
Introduction of different low-K to ultra low-K dielectric material in the spacing between neighbour copper interconnects localised on the same level of metallization is analyzed. It is done to evaluate signal integrity such as crosstalk, propagation delay and rise time on a set of several unintentionally coupled Cu lines of micron and nanometer sizes. A full wave analysis based on tangential vector finite element method is implemented in MATLAB environment in order to extract, via a transmission multicoupled line model, the electrically R, L, C, G, Lm, Cm coupled elementary cell. This model with all the mutual impedance and admittance is necessary and more convenient for transient analysis by using commercial software such as Spice or other transient tool. We show that the improvement due to the introduction of low dielectric material can reach more than 200% for the crosstalk and 25% on propagation delay for 1 mm interconnect length. This work also highlights that it is not always realistic to study only a set of two or three lines because some signals appears at the far end of the second or the third interconnect located at the both sides of an attacker.
本研究分析了在同一金属化水平上的相邻铜互连线之间的间距中引入不同的低 K 至超低 K 介电材料的情况。分析的目的是评估信号完整性，如微米和纳米尺寸的一组无意耦合铜线上的串扰、传播延迟和上升时间。在 MATLAB 环境中实施了基于切向矢量有限元法的全波分析，以便通过传输多耦合线路模型提取电 R、L、C、G、Lm、Cm 耦合基本单元。该模型包含所有互阻抗和导纳，对于使用 Spice 等商业软件或其他瞬态工具进行瞬态分析非常必要，也更加方便。我们的研究表明，对于 1 毫米的互连长度，引入低介电材料可使串扰改善 200%以上，传播延迟改善 25%。这项工作还强调，只研究一组两条或三条线路并不总是现实的，因为有些信号会出现在位于攻击者两侧的第二条或第三条互连线路的远端。
{"title":"Comparison of the benefits, from SiO2 to ultralow-K dielectric and air spacing introduction, in term of interconnects performances, for the future high speed Ic’s in a multicoupled lines system","authors":"F. Ponchel, J. Legier, E. Paleczny, C. Seguinot, D. Deschacht","doi":"10.1109/SPI.2007.4512199","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512199","url":null,"abstract":"Introduction of different low-K to ultra low-K dielectric material in the spacing between neighbour copper interconnects localised on the same level of metallization is analyzed. It is done to evaluate signal integrity such as crosstalk, propagation delay and rise time on a set of several unintentionally coupled Cu lines of micron and nanometer sizes. A full wave analysis based on tangential vector finite element method is implemented in MATLAB environment in order to extract, via a transmission multicoupled line model, the electrically R, L, C, G, Lm, Cm coupled elementary cell. This model with all the mutual impedance and admittance is necessary and more convenient for transient analysis by using commercial software such as Spice or other transient tool. We show that the improvement due to the introduction of low dielectric material can reach more than 200% for the crosstalk and 25% on propagation delay for 1 mm interconnect length. This work also highlights that it is not always realistic to study only a set of two or three lines because some signals appears at the far end of the second or the third interconnect located at the both sides of an attacker.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129300324","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512227
P. Huray, S. Hall, S. Pytel, F. Oluwafemi, R. Mellitz, D. Hua, Peng Ye
SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D "snowball" structure of copper surface distortions. We have developed an analytical basis for the electromagnetic scattering by the copper "snowballs" to predict additional power losses to those presented by the propagating medium that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3D scattering theory of our analysis.
{"title":"Fundamentals of a 3-D “snowball” model for surface roughness power losses","authors":"P. Huray, S. Hall, S. Pytel, F. Oluwafemi, R. Mellitz, D. Hua, Peng Ye","doi":"10.1109/SPI.2007.4512227","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512227","url":null,"abstract":"SEM photographs of a typical copper conductors prepared by the PCB industry exhibit a 3-D \"snowball\" structure of copper surface distortions. We have developed an analytical basis for the electromagnetic scattering by the copper \"snowballs\" to predict additional power losses to those presented by the propagating medium that compare well with the observed measurements for a set of rough microstrip lines. In this paper we describe the fundamental concepts involved with the 3D scattering theory of our analysis.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132923712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512247
M. Burford, P. Levin, T. Kazmierski
The use of current methods of length matching in differential microstrip transmission lines when used with data-rates up to 15 GHz is explored. It is shown that using current methods of length matching could make worse mode conversion and EM loss than with no length matching at all. A new method is suggested whereby interconnect geometry can be engineered to match the length of a pair at a specific or dominant frequency, while also minimizing reflections. This is achieved through appropriate engineering of de-skew wiglets, variation of their positioning, geometry and number.
{"title":"Skew and EMI management in differential microstrip lines up to 15GHz","authors":"M. Burford, P. Levin, T. Kazmierski","doi":"10.1109/SPI.2007.4512247","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512247","url":null,"abstract":"The use of current methods of length matching in differential microstrip transmission lines when used with data-rates up to 15 GHz is explored. It is shown that using current methods of length matching could make worse mode conversion and EM loss than with no length matching at all. A new method is suggested whereby interconnect geometry can be engineered to match the length of a pair at a specific or dominant frequency, while also minimizing reflections. This is achieved through appropriate engineering of de-skew wiglets, variation of their positioning, geometry and number.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127643888","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512251
V. Ricchiuti, A. Orlandi, G. Antonini
Today the telecommunication equipments are characterized by transmission bandwidths of tents of GHz. Consequently the digital signals into play reach data rates of some Gbps with rise/fall times of few picoseconds. In this context it is important to correctly characterize the transmission lines on boards for studying the signal propagation as a function of the frequency. The more effective technique starts from measurements, connecting the studied traces to the measurement instruments by means of transition networks or fixtures. But in this case the connective errors due to the connector mismatches and discontinuities have to be removed. The paper proposes different mathematical de- embedding procedures to evaluate the propagation constant of differential traces, de-embedded by the effects of the SMA's connecting them to the VNA.
{"title":"Evaluation of the propagation constants of differential PCB interconnections","authors":"V. Ricchiuti, A. Orlandi, G. Antonini","doi":"10.1109/SPI.2007.4512251","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512251","url":null,"abstract":"Today the telecommunication equipments are characterized by transmission bandwidths of tents of GHz. Consequently the digital signals into play reach data rates of some Gbps with rise/fall times of few picoseconds. In this context it is important to correctly characterize the transmission lines on boards for studying the signal propagation as a function of the frequency. The more effective technique starts from measurements, connecting the studied traces to the measurement instruments by means of transition networks or fixtures. But in this case the connective errors due to the connector mismatches and discontinuities have to be removed. The paper proposes different mathematical de- embedding procedures to evaluate the propagation constant of differential traces, de-embedded by the effects of the SMA's connecting them to the VNA.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131426637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512254
S. Ghosh, A. Roy, A. Chakrabarty
This paper presents the coupling effects of multiple bent interconnects separated by an internal angle. The method of moments with pulse basis function and point-matching has been used for the modeling of the wires. The mutual impedance of the bent interconnects has been characterized in a wide range of frequencies. From the studies of different bent structures it has been found that the right angle bent wire is the best with the least mutual coupling effect between the interconnects.
{"title":"Electromagnetic coupling analysis of high density bent interconnects","authors":"S. Ghosh, A. Roy, A. Chakrabarty","doi":"10.1109/SPI.2007.4512254","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512254","url":null,"abstract":"This paper presents the coupling effects of multiple bent interconnects separated by an internal angle. The method of moments with pulse basis function and point-matching has been used for the modeling of the wires. The mutual impedance of the bent interconnects has been characterized in a wide range of frequencies. From the studies of different bent structures it has been found that the right angle bent wire is the best with the least mutual coupling effect between the interconnects.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"160 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122037591","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512229
K. Halbe, I. Roda, E. Griese
Accurate modelling of signal propagation on optical interconnects is very important to improve and speed up the progress of integrating optical interconnections into the conventional manufacturing process of electrical-optical layouts. In this paper a model is introduced which represents the coupling of optical power from a laser diode into a dielectric waveguide with a rectangular cross section. The model is based on the mode matching method. The same model is used to represent the coupling between different straight waveguides in order to simulate signal propagation by applying the time dependent coupled power theory.
{"title":"Coupling and signal propagation model of multimode waveguides with rough core-cladding interfaces","authors":"K. Halbe, I. Roda, E. Griese","doi":"10.1109/SPI.2007.4512229","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512229","url":null,"abstract":"Accurate modelling of signal propagation on optical interconnects is very important to improve and speed up the progress of integrating optical interconnections into the conventional manufacturing process of electrical-optical layouts. In this paper a model is introduced which represents the coupling of optical power from a laser diode into a dielectric waveguide with a rectangular cross section. The model is based on the mode matching method. The same model is used to represent the coupling between different straight waveguides in order to simulate signal propagation by applying the time dependent coupled power theory.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117210460","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512225
P. Kotiranta, I. Kelander, M. Rouvala, J. Takaneva
Mobile device application interface specifications have reached the data speed of gigabit per second per differential lane. Together with increased component density, miniaturization, multi-part devices, and increased signaling frequencies overlapping RF bands, the prediction of interface and system level behavior in terms of signal integrity becomes more and more complicated. This paper concentrates on signal quality studies of a gigabit-speed digital serial interface. The test system is implemented considering a mobile device with moving parts, and corresponding simulation models are built using various simulation tools. The study discusses the correlation between measured and simulated results, adducing also the modeling feasibility of the test system.
{"title":"Characterization of flexible interconnects in mobile devices","authors":"P. Kotiranta, I. Kelander, M. Rouvala, J. Takaneva","doi":"10.1109/SPI.2007.4512225","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512225","url":null,"abstract":"Mobile device application interface specifications have reached the data speed of gigabit per second per differential lane. Together with increased component density, miniaturization, multi-part devices, and increased signaling frequencies overlapping RF bands, the prediction of interface and system level behavior in terms of signal integrity becomes more and more complicated. This paper concentrates on signal quality studies of a gigabit-speed digital serial interface. The test system is implemented considering a mobile device with moving parts, and corresponding simulation models are built using various simulation tools. The study discusses the correlation between measured and simulated results, adducing also the modeling feasibility of the test system.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131048386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-05-13DOI: 10.1109/SPI.2007.4512237
D. Andersson, L. Svensson, P. Larsson-Edefors
We present a systematic way of performing sensitivity analysis on on-chip power distribution grids. By using factor analysis we are able to uncover correlations between power grid design variables and power supply noise. From our analysis of 300 different grids in a 65-nm process, we can identify which power grid design variables have both high correlation to and high impact on noise; the most important one being supply rail width.
{"title":"Toward a systematic sensitivity analysis of on-chip power grids using factor analysis","authors":"D. Andersson, L. Svensson, P. Larsson-Edefors","doi":"10.1109/SPI.2007.4512237","DOIUrl":"https://doi.org/10.1109/SPI.2007.4512237","url":null,"abstract":"We present a systematic way of performing sensitivity analysis on on-chip power distribution grids. By using factor analysis we are able to uncover correlations between power grid design variables and power supply noise. From our analysis of 300 different grids in a 65-nm process, we can identify which power grid design variables have both high correlation to and high impact on noise; the most important one being supply rail width.","PeriodicalId":206352,"journal":{"name":"2007 IEEE Workshop on Signal Propagation on Interconnects","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-05-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128782218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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