{"title":"微系统自顶向下设计中参数化有限元模型自动转换为cad布局格式","authors":"M. Lang, D. David, M. Glesner","doi":"10.1109/EDTC.1997.582359","DOIUrl":null,"url":null,"abstract":"A tool for the transfer of solid models used for FEM simulations into different layout formats used by CAD environments is presented. All necessary layers for the fabrication of microcomponents and systems in a given extended commercial CMOS process are generated automatically by this tool. Starting with an acceleration sensor the use of this translator for an application in the top-down design of microsystems with parametric components is described.","PeriodicalId":297301,"journal":{"name":"Proceedings European Design and Test Conference. ED & TC 97","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Automatic transfer of parametric FEM models into CAD-layout formats for top-down design of microsystems\",\"authors\":\"M. Lang, D. David, M. Glesner\",\"doi\":\"10.1109/EDTC.1997.582359\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A tool for the transfer of solid models used for FEM simulations into different layout formats used by CAD environments is presented. All necessary layers for the fabrication of microcomponents and systems in a given extended commercial CMOS process are generated automatically by this tool. Starting with an acceleration sensor the use of this translator for an application in the top-down design of microsystems with parametric components is described.\",\"PeriodicalId\":297301,\"journal\":{\"name\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings European Design and Test Conference. ED & TC 97\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDTC.1997.582359\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings European Design and Test Conference. ED & TC 97","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTC.1997.582359","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automatic transfer of parametric FEM models into CAD-layout formats for top-down design of microsystems
A tool for the transfer of solid models used for FEM simulations into different layout formats used by CAD environments is presented. All necessary layers for the fabrication of microcomponents and systems in a given extended commercial CMOS process are generated automatically by this tool. Starting with an acceleration sensor the use of this translator for an application in the top-down design of microsystems with parametric components is described.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
