{"title":"表面加工微机械膜泵","authors":"J. Judy, T. Tamagawa, D. Polla","doi":"10.1109/MEMSYS.1991.114792","DOIUrl":null,"url":null,"abstract":"An electrostatic micromechanical membrane pump for fluids and gases has been designed and fabricated with a process that is compatible with integrated circuits. The process consists of six photolithography steps and eight low-pressure chemical vapor depositions. No bulk silicon etchants or wafer bonding techniques are used. Each pump consists of an input valve, a pumping membrane, and an output valve. All parts are encapsulated by silicon nitride and are actuated by electrostatic forces. Actuation voltages of approximately 50 V are required for observable valve closure and membrane deflections. Typical gas pumping displacements are between 12 to 640 nL per cycle.<<ETX>>","PeriodicalId":258054,"journal":{"name":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"63","resultStr":"{\"title\":\"Surface-machined micromechanical membrane pump\",\"authors\":\"J. Judy, T. Tamagawa, D. Polla\",\"doi\":\"10.1109/MEMSYS.1991.114792\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An electrostatic micromechanical membrane pump for fluids and gases has been designed and fabricated with a process that is compatible with integrated circuits. The process consists of six photolithography steps and eight low-pressure chemical vapor depositions. No bulk silicon etchants or wafer bonding techniques are used. Each pump consists of an input valve, a pumping membrane, and an output valve. All parts are encapsulated by silicon nitride and are actuated by electrostatic forces. Actuation voltages of approximately 50 V are required for observable valve closure and membrane deflections. Typical gas pumping displacements are between 12 to 640 nL per cycle.<<ETX>>\",\"PeriodicalId\":258054,\"journal\":{\"name\":\"[1991] Proceedings. IEEE Micro Electro Mechanical Systems\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1991-01-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"63\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"[1991] Proceedings. IEEE Micro Electro Mechanical Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.1991.114792\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings. IEEE Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.1991.114792","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An electrostatic micromechanical membrane pump for fluids and gases has been designed and fabricated with a process that is compatible with integrated circuits. The process consists of six photolithography steps and eight low-pressure chemical vapor depositions. No bulk silicon etchants or wafer bonding techniques are used. Each pump consists of an input valve, a pumping membrane, and an output valve. All parts are encapsulated by silicon nitride and are actuated by electrostatic forces. Actuation voltages of approximately 50 V are required for observable valve closure and membrane deflections. Typical gas pumping displacements are between 12 to 640 nL per cycle.<>
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