短通道hemt的电子动力学和器件物理:横畴形成、速度超调和短通道效应

Y. Awano, M. Kosugi, S. Kuroda, T. Mimura, M. Abe
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引用次数: 3

摘要

作者模拟了亚四分之一微米栅极高电子迁移率晶体管(hemt)的电子动力学和物理,并制作了器件来验证他们的短沟道效应理论。他们证实了栅极下的近弹道电子传递,并预测了横向畴的形成。他们引入了一个称为通道宽高比的参数,该参数可以作为确定短通道效应程度的设计规则。测量结果表明,对于短至0.14 μ m的栅极,阈值电压位移几乎可以忽略不计。因此,在所研究的范围内,hemt确实需要特殊的设计,这将限制其应用。
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Electron dynamics and device physics of short-channel HEMTs: transverse-domain formation, velocity overshoot, and short-channel effects
The authors simulated the electron dynamics and physics in sub-quarter-micron-gate HEMTs (high electron mobility transistors) and fabricated devices for testing their theories on the short-channel effect. They confirmed near-ballistic electron transport under the gate and predicted transverse-domain formation. They introduce a parameter called the channel aspect ratio, which could serve as a design rule for determining the extent of the short-channel effect. Measurements show that the threshold voltage shift is almost negligible for gates as short as 0.14 mu m. Thus, within the range studied, HEMTs do require a special design that would limit their applications.<>
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