Yasuyuki Ookura, Nobuhiko Kato, Shin-ichiroh Kobayashi, T. Kuwabara, Masanori Harada, Kentaro Yamaguchi, H. Koike
{"title":"一个三维TCAD系统,专注于功率和纳米级器件的应用","authors":"Yasuyuki Ookura, Nobuhiko Kato, Shin-ichiroh Kobayashi, T. Kuwabara, Masanori Harada, Kentaro Yamaguchi, H. Koike","doi":"10.1109/SISPAD.2014.6931597","DOIUrl":null,"url":null,"abstract":"A new 3-D TCAD system has been proposed aiming close coupling of first-principles calculator, process, and device simulators in response to requirements for ultra-small to high-power semiconductor devices. Using the first-principles calculator Schottky-barrier height has been derived. In the process simulator, a robust and high-speed topographical algorithm has been newly proposed and thus easier handling of complicated 3-D structure has been provided. And a 3-D effect due to arsenic deactivation has been demonstrated. In the device simulator, robust calculation for high-voltage breakdown characteristics of wide-gap devices has been demonstrated.","PeriodicalId":101858,"journal":{"name":"2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A three-dimensional TCAD system focused on power and nano-scaled devices applications\",\"authors\":\"Yasuyuki Ookura, Nobuhiko Kato, Shin-ichiroh Kobayashi, T. Kuwabara, Masanori Harada, Kentaro Yamaguchi, H. Koike\",\"doi\":\"10.1109/SISPAD.2014.6931597\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new 3-D TCAD system has been proposed aiming close coupling of first-principles calculator, process, and device simulators in response to requirements for ultra-small to high-power semiconductor devices. Using the first-principles calculator Schottky-barrier height has been derived. In the process simulator, a robust and high-speed topographical algorithm has been newly proposed and thus easier handling of complicated 3-D structure has been provided. And a 3-D effect due to arsenic deactivation has been demonstrated. In the device simulator, robust calculation for high-voltage breakdown characteristics of wide-gap devices has been demonstrated.\",\"PeriodicalId\":101858,\"journal\":{\"name\":\"2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SISPAD.2014.6931597\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SISPAD.2014.6931597","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A three-dimensional TCAD system focused on power and nano-scaled devices applications
A new 3-D TCAD system has been proposed aiming close coupling of first-principles calculator, process, and device simulators in response to requirements for ultra-small to high-power semiconductor devices. Using the first-principles calculator Schottky-barrier height has been derived. In the process simulator, a robust and high-speed topographical algorithm has been newly proposed and thus easier handling of complicated 3-D structure has been provided. And a 3-D effect due to arsenic deactivation has been demonstrated. In the device simulator, robust calculation for high-voltage breakdown characteristics of wide-gap devices has been demonstrated.