基于FinFET的SRAM puf静态噪声裕度建模

S. Masoumian, G. Selimis, Roel Maes, G. Schrijen, S. Hamdioui, M. Taouil
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引用次数: 4

摘要

在本文中,我们基于紧凑的FinFET晶体管模型开发了一个分析PUF模型,该模型计算了基于FinFET的sram的PUF稳定性(即PUF静态噪声裕度(PSNM))。该模型能够快速探索设计空间,并可用于识别影响PSNM的关键参数。通过SPICE仿真对分析模型进行了验证。在实验中,我们分析了工艺变化、技术和温度对PSNM的影响。结果表明,解析模型与仿真模型吻合较好。从实验我们得出结论如下:(1)场效应电晶体变化有更大的影响比pFET PSNM PSNM场效应电晶体的变化(1.5%高于pFET变化25°C),(2)高性能SRAM细胞更倾斜(PSNM高出1.3%)(3)再现性增加较小的技术节点(0.8% PSNM从20增加到14海里)(4)增加温度从−10°C到120°C会导致PSNM变化约1.0%的极端场效应电晶体通道长度。
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Modeling Static Noise Margin for FinFET based SRAM PUFs
In this paper, we develop an analytical PUF model based on a compact FinFET transistor model that calculates the PUF stability (i.e. PUF static noise margin (PSNM)) for FinFET based SRAMs. The model enables a quick design space exploration and may be used to identify critical parameters that affect the PSNM. The analytical model is validated with SPICE simulations. In our experiments, we analyze the impact of process variation, technology, and temperature on the PSNM. The results show that the analytical model matches very well with the simulation model. From the experiments we conclude the following: (1) nFET variations have a larger impact on the PSNM than pFET (1.5% higher PSNM in nFET variations than pFET variations at 25°C), (2) high performance SRAM cells are more skewed (1.3% higher PSNM) (3) the reproducibility increases with smaller technology nodes (0.8% PSNM increase from 20 to 14 nm) (4) increasing the temperature from −10°C to 120°C leads to a PSNM change of approximately 1.0% for an extreme nFET channel length.
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