用于汽车应用的半导体工业缺陷数据的检测方法和机器学习方法:现场故障预防的案例研究

C. Bergès, J. Bird, M. Shroff, Edwin Lumanauw, Sreerag Raghunathan, Chris Smith
{"title":"用于汽车应用的半导体工业缺陷数据的检测方法和机器学习方法:现场故障预防的案例研究","authors":"C. Bergès, J. Bird, M. Shroff, Edwin Lumanauw, Sreerag Raghunathan, Chris Smith","doi":"10.1109/IPFA55383.2022.9915769","DOIUrl":null,"url":null,"abstract":"Big-data infrastructure and environment enable the ability to connect and store data to develop and deploy machine-learning activities and analysis in various industries. Equipment manufacturers are implementing new artificial-intelligence capabilities on their tool platforms, thus pushing manufacturers themselves to use data provided by these new functionalities and to link them with other data from their processes. Then, the manufacturer who uses this new artificial-intelligence data is seeking to connect them to some other of internal data, such as the electrical test results per die, in a new type of analysis, with the purpose to improve the screening offered by the electrical test, and thus to increase overall quality. This paper reports new capabilities in automated optical inspection, implemented in automotive-semiconductor manufacturing, which predict a probability of failure per die, computed by the inspection equipment from the features of the observed defects, and presents some significant results in the case of a product implemented in automotive RADAR products.","PeriodicalId":378702,"journal":{"name":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Inspection methodologies and machine-learning approaches for defectivity data in semiconductor industry for automotive applications: case study for field-failure prevention\",\"authors\":\"C. Bergès, J. Bird, M. Shroff, Edwin Lumanauw, Sreerag Raghunathan, Chris Smith\",\"doi\":\"10.1109/IPFA55383.2022.9915769\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Big-data infrastructure and environment enable the ability to connect and store data to develop and deploy machine-learning activities and analysis in various industries. Equipment manufacturers are implementing new artificial-intelligence capabilities on their tool platforms, thus pushing manufacturers themselves to use data provided by these new functionalities and to link them with other data from their processes. Then, the manufacturer who uses this new artificial-intelligence data is seeking to connect them to some other of internal data, such as the electrical test results per die, in a new type of analysis, with the purpose to improve the screening offered by the electrical test, and thus to increase overall quality. This paper reports new capabilities in automated optical inspection, implemented in automotive-semiconductor manufacturing, which predict a probability of failure per die, computed by the inspection equipment from the features of the observed defects, and presents some significant results in the case of a product implemented in automotive RADAR products.\",\"PeriodicalId\":378702,\"journal\":{\"name\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"126 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA55383.2022.9915769\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA55383.2022.9915769","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

大数据基础设施和环境能够连接和存储数据,从而在各个行业中开发和部署机器学习活动和分析。设备制造商正在其工具平台上实施新的人工智能功能,从而推动制造商自己使用这些新功能提供的数据,并将其与流程中的其他数据联系起来。然后,使用这种新的人工智能数据的制造商正在寻求将它们与其他一些内部数据联系起来,例如每个模具的电气测试结果,以一种新的分析方式,目的是改善电气测试提供的筛选,从而提高整体质量。本文报道了在汽车半导体制造中实现的自动光学检测的新功能,该功能可以预测每个模具的失效概率,由检测设备根据观察到的缺陷的特征计算出来,并在汽车雷达产品中实现了一些重要的结果。
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Inspection methodologies and machine-learning approaches for defectivity data in semiconductor industry for automotive applications: case study for field-failure prevention
Big-data infrastructure and environment enable the ability to connect and store data to develop and deploy machine-learning activities and analysis in various industries. Equipment manufacturers are implementing new artificial-intelligence capabilities on their tool platforms, thus pushing manufacturers themselves to use data provided by these new functionalities and to link them with other data from their processes. Then, the manufacturer who uses this new artificial-intelligence data is seeking to connect them to some other of internal data, such as the electrical test results per die, in a new type of analysis, with the purpose to improve the screening offered by the electrical test, and thus to increase overall quality. This paper reports new capabilities in automated optical inspection, implemented in automotive-semiconductor manufacturing, which predict a probability of failure per die, computed by the inspection equipment from the features of the observed defects, and presents some significant results in the case of a product implemented in automotive RADAR products.
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