MEMS用PZT厚膜

S. Gebhardt, U. Partsch, A. Schonecker
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引用次数: 4

摘要

Al2O3、硅和低温共烧陶瓷(LTCC)是构成微系统技术衬底基础的关键功能材料。它们允许三维组件集成,高鲁棒性和出色的可靠性。这些衬底材料与压电薄膜的结合提供了先进的传感器,执行器和超声波换能器解决方案,开辟了新的应用领域。我们研制了一种具有优异介电性能和机电性能的PZT厚膜浆料。结合特殊电极和阻挡层,实现了一种允许开发定制产品的技术。
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PZT thick films for MEMS
Al2O3, silicon and low temperature cofired ceramics (LTCC) are key functional materials, forming the substrate basis in microsystems technologies. They allow for three dimensional component integration, high robustness and excellent reliability. The combination of these substrate materials with piezoelectric films offer advanced sensor, actuator and ultrasonic transducer solutions which open up new fields of applications. We developed a PZT thick film paste with excellent dielectric and electromechanical properties. In combination with special electrode and barrier layers a technology was achieved allowing for the development of custom products.
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