基于fowlp的柔性混合电子与3D-IC芯片用于智能皮肤显示

Y. Susumago, T. Odashima, M. Ichikawa, Hiroki Hanaoka, H. Kino, Tetsu Tanaka, T. Fukushima
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引用次数: 4

摘要

本文讨论了一种灵活的3D-IC系统制造方法。mini - led和3D-IC芯片从带有cu - tsv的大型3D-IC中分离出来,嵌入基于模首FOWLP的弹性体PDMS中,用于将它们作为生物医学/可穿戴FHE(柔性混合电子产品)异构集成到智能皮肤显示中。我们通过使用一种新的锚定层技术,解决了模具优先级FOWLP中微小芯片的严重模移问题,将模移大幅度减少在$2.7\ \mu\ mathm {m}$内,包括装配定位误差。在曲率半径为10 mm的情况下,对3D-IC芯片柔性阵列的力学/电学性能进行了表征。此外,应力中性轴的设计可以稳定地承受弯曲循环,适用于多层次金属化的生物医学/可穿戴FHE。
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FOWLP-Based Flexible Hybrid Electronics with 3D-IC Chiplets for Smart Skin Display
This paper deals with a flexible 3D-IC system fabrication methodology. Mini-LEDs and 3D-IC chiplets divided from a large 3D-IC with Cu-TSVs are embedded in an elastomer PDMS based on die-first FOWLP for heterogeneously integrating them into Smart Skin Display as a biomedical/wearable FHE (flexible hybrid electronics). We address a serious die-shift issue for the tiny chips in die-first FOWLP by using a new anchoring layer technique to drastically reduce the shift within $2.7\ \mu\mathrm{m}$ including assembly positioning errors. The mechanical/electrical properties of the flexible array of 3D-IC chiplets are characterized before and after repeated bending with a curvature radius of 10 mm. In addition, stress neutral axes are designed to stably endure bending cycle applicable to the biomedical/wearable FHE with multi-level metallization.
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