Development of MCM-D technology with photosensitive benzocyclobutene

This paper evaluates the development of Multi-Chip Module Deposited (MCM-D) technology using photosensitive benzocyclobutene (BCB) to produce passive devices. The polymer was used as the dielectric and Ni-P/Au was used as the conductor film. The resistors' sheet resistance was measured with both TLM and direct measurement while the measurements of the capacitors and inductors required the usage of a Vector Network Analyzer (VNA) and treatment of the obtained s-parameters matrix in order to extract the values of both the capacitances and inductances.