三维可重构多处理器架构的时空调度

Quang-Hai Khuat, Quang-Hoa Le, D. Chillet, S. Pillement
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引用次数: 1

摘要

本文提出了一种三维集成电路(3D ic)的时空调度算法,该算法通过在硅通孔(tsv)连接上的同质芯片多处理器(CMP)层上堆叠同质嵌入式现场可编程门阵列(eFPGA)来定义。基于比例公平(Pfair)算法,考虑任务间的通信,计算硬件任务在可重构资源上的时空调度,并将相关的软件任务置于多处理器层。与递归分支边界(BB)算法产生的“等效”解决方案相比,我们的方案显示了高达14.5%的通信成本降低。
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Spatio-temporal scheduling for 3D reconfigurable & multiprocessor architecture
This article proposes a spatio-temporal scheduling algorithm for a three-dimensional integrated circuits (3D ICs) defined by stacking an homogeneous embedded Field-Programmable Gate Array (eFPGA) above an homogenous Chip MultiProcessor (CMP) layer over through-silicon vias (TSVs) connection. Our proposal, based on Proportionate-fair (Pfair) algorithm, computes the spatio-temporal scheduling of hardware tasks on the reconfigurable resources by taking into account the communication between tasks and then places the associated software tasks on the multiprocessors layer. Compared to the “equivalent” solutions produced by the recursive Branch and Bound (BB) algorithm, our proposal shows up to 14,5% communication cost reduction.
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