用于恶劣环境应用的Cu-Sn slip互连特性

2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Pub Date : 2014-04-01 DOI:10.1109/DTIP.2014.7056665

A. Campos-Zatarain, D. Flynn, K. Aasmundtveit, N. Hoivik, K. Wang, H. Liu, T. Luu, M. Mirgkizoudi, R. Kay

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引用次数: 0

摘要

本文报道了用Cu-Sn slip技术对验证车进行“摇烤”试验的结果。演示车辆同时暴露在与航空航天和井下应用类似的振动和热载荷下。这项工作表明，Cu-Sn slip键合工艺是在恶劣环境中使用的封装传感器和电子产品的理想选择，特别是在航空航天和石油天然气行业中遇到的情况。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Characterization of Cu-Sn SLID interconnects for harsh environment applications

This paper reports on the results obtained from performing "shake and bake" testing on demonstrator vehicles bonded using Cu-Sn SLID technique. The demonstrator vehicles were exposed concurrently to vibration and thermal loadings similar to those seen in aerospace and downhole applications. This work demonstrates that Cu-Sn SLID bonding process is ideal for packaging sensors and electronics to be used within harsh environments, especially those encountered in the aerospace and oil & gas industries.

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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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