一种多区域陷阱表征方法及其在st基高压ldmosfet上的可靠性应用

Yandong He, Ganggang Zhang, Xing Zhang
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引用次数: 1

摘要

基于sti的横向扩散金属氧化物半导体(LDMOS)器件以其更好地平衡击穿电压和导通电阻以及与标准互补金属氧化物半导体(CMOS)工艺的兼容性而受到欢迎。本文提出了一种多区域陷阱表征直流电压(MR-DCIV)技术来表征通道和STI漂移区域的界面状态产生。通过二维器件仿真验证了界面陷阱与MR-DCIV电流的相关性。利用该技术对基于sti的LDMOS晶体管在各种可靠性应力模式下的退化进行了实验研究。从测量和仿真两方面分析了界面状态位置对器件电特性的影响。我们的研究表明,就导通电阻退化而言,off状态应力成为最严重的退化模式,这归因于STI漂移区域下界面状态的产生。
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A multi-region trap characterization method and its reliability application on STI-based high-voltage LDMOSFETs
The STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices have become popular with its better tradeoff between breakdown voltage and on-resistance and its compatibility with the standard complementary metal-oxide-semiconductor (CMOS) process. In this paper, a multi-region trap characterization direct current current-voltage (MR-DCIV) technique was proposed to characterize interface state generation in both channel and STI drift regions. The correlation between interface trap and MR-DCIV current has been verified by two-dimensional device simulation. Degradation of STI-based LDMOS transistors in various reliability stress modes is investigated experimentally by proposed technique. The impact of interface state location on device electrical characteristics is analyzed from measurement and simulation. Our study reveals that OFF-state stress becomes the worst degradation mode in term of the on-resistance degradation, which is attributed to interface state generation under STI drift region.
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