在低功率下用定时试验检测栅极氧化物缺陷

Xi Qian, Chao Han, A. Singh
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引用次数: 9

摘要

在本文中,我们的重点是检测小的栅极氧化物缺陷,这些缺陷可以逃避生产测试,但在正常运行时导致早期寿命失效(ELF)。过去已经提出过极低电压(VLV)和MinVDD测试来筛选这种“弱”ic。然而,由于在给定的技术中不能任意降低电源电压,因此,没有严重到足以触发逻辑故障的小缺陷仍然可以逃脱此类测试。我们提出了一种新的方法,通过在减少电源环境中应用定时测试来提高检测这些小栅极氧化物缺陷的灵敏度。虽然不会严重到导致逻辑故障,但小的氧化物缺陷仍然可以在受影响路径的时序中引入可观察到的异常,这种异常在电源电压降低时被放大。采用NanGate 45nm工艺进行了实验仿真,验证了本文的结论。
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Detection of gate-oxide defects with timing tests at reduced power supply
In this paper, we focus on the detection of small gate-oxide defects, which can escape production tests but lead to early-life-failures (ELF) during normal operation. Very-Low-Voltage (VLV) and MinVDD testing have been proposed in the past to screen such “weak” ICs. However, small defects that are not severe enough to trigger logic failures can still escape such tests given the fact that power supply voltage cannot be arbitrarily lowered in a given technology. We suggest a novel approach for increasing the sensitivity of detection of these small gate-oxide defects by applying timing tests in a reduced power supply environment. While not severe enough to cause logic failures, small oxide defects can still introduce observable anomalies in the timing of affected paths, which is amplified at reduced power supply voltages. Experimental simulation results using NanGate 45nm technology are provided to substantiate our conclusions.
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