0402和0204陶瓷芯片电容器在封装上去耦应用的选择标准和权衡

2007 IEEE Electrical Performance of Electronic Packaging Pub Date : 2007-11-21 DOI:10.1109/EPEP.2007.4387160

B. Young

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摘要

使用封装和PCB的3D PEEC模型进行全面的详细时域模拟，以绘制设计空间并设置用作封装上去耦电容器的0402和0204陶瓷芯片电容器的性能期望。

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Selection Criteria and Tradeoffs for 0402 and 0204 Ceramic Chip Capacitors for On-Package Decoupling Applications

A comprehensive sweep of detailed time-domain simulations using 3D PEEC models of the package and PCB are used to map out the design space and to set performance expectations for 0402 and 0204 ceramic chip capacitors for use as on-package decoupling capacitors.

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2007 IEEE Electrical Performance of Electronic Packaging

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