{"title":"用于军事环境的Mcm技术","authors":"D. R. Schroeder, L.J. Rexing","doi":"10.1109/ICMCM.1994.753616","DOIUrl":null,"url":null,"abstract":"The design guidelines currently being incorporated in the design and fabrication of LTCC MCM's will be reviewed and compared to MCM-L and MCM-D design guidelines. Several examples of complex MCM's will be presented ranging in size up to 3\" x 3\" incorporating wire bonding as well as tab bonding. LTCC MCM technology has been established as a flexible cost effective advanced packaging concept for harsh environments.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Ltcc Mcm Technology for Military Environments\",\"authors\":\"D. R. Schroeder, L.J. Rexing\",\"doi\":\"10.1109/ICMCM.1994.753616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design guidelines currently being incorporated in the design and fabrication of LTCC MCM's will be reviewed and compared to MCM-L and MCM-D design guidelines. Several examples of complex MCM's will be presented ranging in size up to 3\\\" x 3\\\" incorporating wire bonding as well as tab bonding. LTCC MCM technology has been established as a flexible cost effective advanced packaging concept for harsh environments.\",\"PeriodicalId\":363745,\"journal\":{\"name\":\"Proceedings of the International Conference on Multichip Modules\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-04-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the International Conference on Multichip Modules\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMCM.1994.753616\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The design guidelines currently being incorporated in the design and fabrication of LTCC MCM's will be reviewed and compared to MCM-L and MCM-D design guidelines. Several examples of complex MCM's will be presented ranging in size up to 3" x 3" incorporating wire bonding as well as tab bonding. LTCC MCM technology has been established as a flexible cost effective advanced packaging concept for harsh environments.
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