采用RTA和等离子体加氢技术的高性能多晶硅TFT,适用于16mbit及以上的高稳定sram

F. Hayashi, M. Kitakata
{"title":"采用RTA和等离子体加氢技术的高性能多晶硅TFT,适用于16mbit及以上的高稳定sram","authors":"F. Hayashi, M. Kitakata","doi":"10.1109/VLSIT.1992.200634","DOIUrl":null,"url":null,"abstract":"A 0.4- mu m polysilicon TFT with I/sub on/ of 5 mu A and I/sub off/ of 10 fA developed by use of the LDO (lightly doped offset) structure and RTA (rapid thermal annealing) and plasma hydrogenation treatment is discussed. These technologies have proved to be essential in realizing high-performance deep submicron TFTs. Highly stable and low-power SRAMs of 16 Mb and beyond can be realized by employing these technologies. Models and mechanisms to explain the effects of various treatments on the performances of the TFTs are proposed.<<ETX>>","PeriodicalId":404756,"journal":{"name":"1992 Symposium on VLSI Technology Digest of Technical Papers","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"A high performance polysilicon TFT using RTA and plasma hydrogenation applicable to highly stable SRAMs of 16 Mbit and beyond\",\"authors\":\"F. Hayashi, M. Kitakata\",\"doi\":\"10.1109/VLSIT.1992.200634\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 0.4- mu m polysilicon TFT with I/sub on/ of 5 mu A and I/sub off/ of 10 fA developed by use of the LDO (lightly doped offset) structure and RTA (rapid thermal annealing) and plasma hydrogenation treatment is discussed. These technologies have proved to be essential in realizing high-performance deep submicron TFTs. Highly stable and low-power SRAMs of 16 Mb and beyond can be realized by employing these technologies. Models and mechanisms to explain the effects of various treatments on the performances of the TFTs are proposed.<<ETX>>\",\"PeriodicalId\":404756,\"journal\":{\"name\":\"1992 Symposium on VLSI Technology Digest of Technical Papers\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 Symposium on VLSI Technology Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.1992.200634\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Symposium on VLSI Technology Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1992.200634","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

本文讨论了采用LDO(轻掺杂偏置)结构、RTA(快速热退火)和等离子体加氢处理制备的I/sub on/ 5 μ A、I/sub off/ 10 μ fA的0.4 μ m多晶硅TFT。这些技术已被证明是实现高性能深亚微米tft的关键。采用这些技术可以实现16mb及以上的高稳定性和低功耗sram。提出了各种处理对tft性能影响的模型和机制。
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A high performance polysilicon TFT using RTA and plasma hydrogenation applicable to highly stable SRAMs of 16 Mbit and beyond
A 0.4- mu m polysilicon TFT with I/sub on/ of 5 mu A and I/sub off/ of 10 fA developed by use of the LDO (lightly doped offset) structure and RTA (rapid thermal annealing) and plasma hydrogenation treatment is discussed. These technologies have proved to be essential in realizing high-performance deep submicron TFTs. Highly stable and low-power SRAMs of 16 Mb and beyond can be realized by employing these technologies. Models and mechanisms to explain the effects of various treatments on the performances of the TFTs are proposed.<>
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