{"title":"VLSI应用中铝金属化失效的温度循环加速因子","authors":"C. Dunn, J. McPherson","doi":"10.1109/RELPHY.1990.66096","DOIUrl":null,"url":null,"abstract":"Low-cycle fatigue data for four common aluminium failure mechanisms in VLSI applications are presented; fractured intermetallic bond failure, chip-out bond failure, shear-stress-induced metal movement and passivation cracking and tensile-stress-induced metal notching and voiding (stress migration). Except for the tensile-stress-induced notching and voiding, uniform acceleration exists when commonly used accelerated temperature cycling ranges are compared: 0 degrees C/125 degrees C, -40 degrees C/85 degrees C, -40 degrees C/140 degrees C, and -65 degrees C/150 degrees C. Tensile-stress induced metal notching and voiding is not uniformly accelerated by temperature cycling; it is accelerated more effectively by simple elevated temperature storage. A temperature-cycling acceleration factor model, based on the Coffin-Manson law, is presented. The problem of using only the temperature cycling range when calculating the acceleration factor is highlighted.<<ETX>>","PeriodicalId":409540,"journal":{"name":"28th Annual Proceedings on Reliability Physics Symposium","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"39","resultStr":"{\"title\":\"Temperature-cycling acceleration factors for aluminium metallization failure in VLSI applications\",\"authors\":\"C. Dunn, J. McPherson\",\"doi\":\"10.1109/RELPHY.1990.66096\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Low-cycle fatigue data for four common aluminium failure mechanisms in VLSI applications are presented; fractured intermetallic bond failure, chip-out bond failure, shear-stress-induced metal movement and passivation cracking and tensile-stress-induced metal notching and voiding (stress migration). Except for the tensile-stress-induced notching and voiding, uniform acceleration exists when commonly used accelerated temperature cycling ranges are compared: 0 degrees C/125 degrees C, -40 degrees C/85 degrees C, -40 degrees C/140 degrees C, and -65 degrees C/150 degrees C. Tensile-stress induced metal notching and voiding is not uniformly accelerated by temperature cycling; it is accelerated more effectively by simple elevated temperature storage. A temperature-cycling acceleration factor model, based on the Coffin-Manson law, is presented. The problem of using only the temperature cycling range when calculating the acceleration factor is highlighted.<<ETX>>\",\"PeriodicalId\":409540,\"journal\":{\"name\":\"28th Annual Proceedings on Reliability Physics Symposium\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"39\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"28th Annual Proceedings on Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1990.66096\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"28th Annual Proceedings on Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1990.66096","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature-cycling acceleration factors for aluminium metallization failure in VLSI applications
Low-cycle fatigue data for four common aluminium failure mechanisms in VLSI applications are presented; fractured intermetallic bond failure, chip-out bond failure, shear-stress-induced metal movement and passivation cracking and tensile-stress-induced metal notching and voiding (stress migration). Except for the tensile-stress-induced notching and voiding, uniform acceleration exists when commonly used accelerated temperature cycling ranges are compared: 0 degrees C/125 degrees C, -40 degrees C/85 degrees C, -40 degrees C/140 degrees C, and -65 degrees C/150 degrees C. Tensile-stress induced metal notching and voiding is not uniformly accelerated by temperature cycling; it is accelerated more effectively by simple elevated temperature storage. A temperature-cycling acceleration factor model, based on the Coffin-Manson law, is presented. The problem of using only the temperature cycling range when calculating the acceleration factor is highlighted.<>