工作温度对焊点性能的影响

I. Plotog, M. Vlădescu
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引用次数: 16

摘要

电子设备向工作温度增长范围和高机械应力水平的方向发展是一种实际趋势。例如,对于RoHS 2欧盟指令豁免的领域(从2013年1月起成为法律),如航空航天,标准最高工作温度为398.15K(125°C)。本文介绍了铅/无铅焊点的电学和力学性能与工作温度和焊接热分布的对比研究结果。实验是基于先前的工作[1,2]设计的,以“同源温度”概念[1,3,4]为起点,以响应根据RoHS 2欧盟指令[5,6]在豁免领域使用无铅焊料合金的鉴定过程所施加的限制。
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Working temperatures influence over the solder joints properties
It is an actual trend for electronic equipment to be used into growing range of working temperatures and at high level of the mechanical stress. As example, for the domains exempted by RoHS 2 EU Directive (it became law from January 2013) like aerospace, the standard maximum working temperature is 398.15K (125°C). The results of the comparative investigations regarding electrical and mechanical properties of the Lead/Lead-free solder joints function of working temperature and soldering thermal profile are presented in the paper. The experiments were designed based on previous work [1,2] having as starting point the “Homologous Temperature” concept [1,3,4], in order to respond to constrains imposed by the qualification processes of lead-free solder alloys for usage into exempted domains according to the RoHS 2 EU Directive [5,6].
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