GSM/GPRS混合信号基带集成电路

2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315) Pub Date : 2002-08-07 DOI:10.1109/ISSCC.2002.992101

D. Redmond, M. Fitzgibbon, A. Bannon, D. Hobbs, Chunhe Zhao, K. Kase, J. Chan, M. Priel, K. Traylor, K. Tilley

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引用次数: 10

摘要

用于GSM/GPRS蜂窝电话应用的双核基带处理器IC采用0.13 /spl mu/m CMOS工艺，5级铜互连，包含高水平的混合信号集成，包括:1 GHz CMOS合成器，10 b通用ADC，两个14 b ADC，功率放大器控制器和13 b语音编解码器。

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A GSM/GPRS mixed-signal baseband IC

A dual-core baseband processor IC for GSM/GPRS cellular phone applications is built in a 0.13 /spl mu/m CMOS process with 5 levels of copper interconnect and contains a high level of mixed-signal integration which includes: 1 GHz CMOS synthesizer, 10 b general-purpose ADC, two 14 b ADCs, power amplifier controller, and 13 b voice codec.

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2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)

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