原位沉积氮化硅碳(SiCN)帽层降低algan基SBD的Shottky势垒高度

Jae-Hoon Lee, Y. Kwak, Jae-Hyun Jeong, Heon-Bok Lee, W. Lim, Ki-Se Kim, Ki‐Won Kim, Dong-Suck Kim, Jung-Hee Lee
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引用次数: 4

摘要

研究了原位氮化硅(SiCN)帽层和原位氮化硅(SiCN)帽层的AlGaN/GaN肖特基势垒二极管(sdd)。与没有SiCN帽层的参考SBD相比,有SiCN帽层的SBD具有更好的电特性,如正向导通电压约为0.7 V, 1.5 V时正向电流为4.1 A,反向击穿电压为630 V,对应值为0.8 V, 3.8 A和580 V。SiCN- sbd器件性能的提高是因为原位SiCN帽层不仅降低了势垒高度,而且有效地钝化了器件表面,具有更好的表面形貌。
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Reduction in Shottky barrier height of AlGaN-based SBD with in-situ deposited silicon carbon nitride (SiCN) cap layer
AlGaN/GaN Schottky barrier diodes (SBDs) with and without in-situ silicon carbon nitride (SiCN) cap layer were investigated. The fabricated SBD with SiCN cap layer exhibited improved electrical characteristics, such as the forward turn on voltage of about 0.7 V, the forward current of 4.1 A at 1.5 V, and the reverse breakdown voltage of 630 V, compared to the corresponding values of 0.8 V, 3.8 A, and 580 V for the reference SBD without the SiCN cap layer. This improvement in the device performance of the SiCN-SBD is because the in-situ SiCN cap layer not only lowers the barrier height, but also effectively passivates the surface of the device with better surface morphology.
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