J. Laskar, A. Sutono, C. Lee, M.F. Davis, M. Maeng, N. Lal, K. Lim, S. Pinel, M. Tentzeris, A. Obatoyinbo
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Development of integrated 3D radio front-end system-on-package (SOP)
This paper presents the development and characterization of compact and highly integrated microwave and millimeter wave radio front-end Systems-on-Package (SOP). The three-dimensional transceiver front-end SOP architectures incorporate on-package integrated lumped element passives as well as RF functions primarily filters, baluns, and antennas in standard multi-layer LTCC and fully-organic technologies. An LTCC-based 14 GHz transmitter for satellite outdoor unit, an OC-192 transmitter incorporating Ku-band Optical Sub-Carrier Multiplexing (OSCM) technique as well fully-organic SOP transmission lines and lumped-element components have been demonstrated. These prototypes suggest the feasibility of developing highly miniaturized cost-effective SOP transceivers applicable not only for wireless but also for optoelectronics links.
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