不同退火方法下射频溅射钛酸钙铜薄膜的电阻开关性能

N. Tripathy, S. Ghosh, D. Pradhan, J. Kar
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引用次数: 1

摘要

采用射频磁控溅射技术在p-Si(100)衬底上制备了钛酸铜钙(CCTO)薄膜。为了改善晶体性能,促进相的形成,采用3种不同的工艺进行沉积后退火,即;常规、快速、顺序退火。所有薄膜的XRD谱图均显示出CCTO峰的演化,证实了950℃时相的形成。传统退火薄膜在较低的FWHM下表现出较好的结晶性能。制备了用于电测量的Al/CCTO/Si金属氧化物半导体(MOS)结构。所有薄膜都表现出在偏置电压扫频下的双极电阻开关特性。与其他样品相比,常规退火薄膜的开/关比为826。双对数图描述了所有薄膜的空间电荷限制导通。
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Resistive Switching Behavior of RF Sputtered Calcium Copper Titanate Thin Films with Various Annealing Approach
Calcium copper titanate (CCTO) thin films were deposited on p-Si (100) substrates by RF magnetron sputtering technique. In order to improve the crystalline properties and to promote the phase formation, post-deposition annealing has been carried out by 3 different type of technique namely; conventional, rapid thermal and sequential annealing. All films have shown the evolution of CCTO peak in XRD pattern confirming the phase formation at 950 °C. Conventionally annealed films have shown better crystalline properties with lower FWHM. Al/CCTO/Si metal oxide semiconductor (MOS)structures were fabricated for electrical measurements. All films have shown bipolar resistive switching behavior with the sweep of bias voltage. Conventionally annealed film has shown good on/off ratio of 826 as compared to other samples. Double logarithmic plots of current-voltage behavior have depicted space charge limited conduction in all the films.
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