{"title":"芯片功耗模型——系统功耗完整性分析与设计的新方法","authors":"E. Kulali, E. Wasserman, Ji Zheng","doi":"10.1109/EPEP.2007.4387176","DOIUrl":null,"url":null,"abstract":"A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.","PeriodicalId":402571,"journal":{"name":"2007 IEEE Electrical Performance of Electronic Packaging","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"34","resultStr":"{\"title\":\"Chip Power Model - A New Methodology for System Power Integrity Analysis and Design\",\"authors\":\"E. Kulali, E. Wasserman, Ji Zheng\",\"doi\":\"10.1109/EPEP.2007.4387176\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.\",\"PeriodicalId\":402571,\"journal\":{\"name\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"34\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE Electrical Performance of Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2007.4387176\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2007.4387176","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Chip Power Model - A New Methodology for System Power Integrity Analysis and Design
A compact SPICE equivalent circuit model of full-chip power network is proposed in this paper to address the system power integrity co-design and optimization. The theory and procedures for the generation of the compact chip power model is described. The accuracy validation of the chip power model is also presented.