{"title":"利用差分耦合微带线减少通过分路功率平面的信号线的反射和地反弹","authors":"G. Shiue, R. Wu","doi":"10.1109/EPEP.2003.1250010","DOIUrl":null,"url":null,"abstract":"The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in the signal return path and ground bounce between power/ground planes. The paper investigates noise reduction by using differential signaling. An efficient 2D FDTD method, together with equivalent circuits for the differential line and the slot, is established and simulations are performed for a three-layer structure to characterize ground bounce coupling.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines\",\"authors\":\"G. Shiue, R. Wu\",\"doi\":\"10.1109/EPEP.2003.1250010\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in the signal return path and ground bounce between power/ground planes. The paper investigates noise reduction by using differential signaling. An efficient 2D FDTD method, together with equivalent circuits for the differential line and the slot, is established and simulations are performed for a three-layer structure to characterize ground bounce coupling.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"95 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250010\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250010","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reduction in reflections and ground bounce for signal line through a split power plane by using differential coupled microstrip lines
The signal propagating along a microstrip line over a slot on the power plane will suffer from composite effects of reflected noise by a discontinuity in the signal return path and ground bounce between power/ground planes. The paper investigates noise reduction by using differential signaling. An efficient 2D FDTD method, together with equivalent circuits for the differential line and the slot, is established and simulations are performed for a three-layer structure to characterize ground bounce coupling.