{"title":"用于功率平面共振分析的电磁系统模型降阶和RLC电路","authors":"T. Watanabe, H. Asai","doi":"10.1109/EPEP.2003.1250032","DOIUrl":null,"url":null,"abstract":"This paper describes an efficient method for generating simulation macromodels of power plane resonances on printed circuit boards (PCB). This method models a PCB as a hybrid system of equations which is composed of electromagnetic systems and RLC circuits. The model order reduction technique is utilized in order to construct macromodels from the hybrid system of equations.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Model order reduction of electromagnetic systems and RLC circuits for power plane resonance analysis\",\"authors\":\"T. Watanabe, H. Asai\",\"doi\":\"10.1109/EPEP.2003.1250032\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes an efficient method for generating simulation macromodels of power plane resonances on printed circuit boards (PCB). This method models a PCB as a hybrid system of equations which is composed of electromagnetic systems and RLC circuits. The model order reduction technique is utilized in order to construct macromodels from the hybrid system of equations.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250032\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250032","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Model order reduction of electromagnetic systems and RLC circuits for power plane resonance analysis
This paper describes an efficient method for generating simulation macromodels of power plane resonances on printed circuit boards (PCB). This method models a PCB as a hybrid system of equations which is composed of electromagnetic systems and RLC circuits. The model order reduction technique is utilized in order to construct macromodels from the hybrid system of equations.
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