用于精确片上电感表征的短去嵌结构布局优化

K. T. M. Shafi, Varuna Baipadi, V. Vanukuru
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引用次数: 0

摘要

本文揭示了典型的短结构在地信地(GSG)衬垫去埋发射线电感中潜在的重大局限性。结果表明,采用常规的开短垫(OSP)去埋法计算得到的电感(L)值明显高于实际值。在电磁模拟的帮助下,证明了L计算中这种不准确的短时间去嵌入背后的机制。提出了一种简单的替代短结构来缓解这一问题。所提出的结构经过了广泛的验证,使用校准良好的电磁模拟跨电感几何形状。最后,对带有GSG衬垫的螺旋电感的测量结果验证了该方法的有效性。
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Layout Optimization of Short De-embedding Structure for Accurate On-Chip Inductor Characterization
A potentially significant limitation of typical short structure in de-embedding launch line inductance with ground-signal-ground (GSG) padsets is revealed in this paper. It is shown that the calculated inductance (L) value with conventional open-short-pad (OSP) de-embedding is significantly higher than the actual value. With the help of electro-magnetic (EM) simulations, the mechanism behind this inaccurate short de-embedding for L calculation is demonstrated. A simple alternative short structure is proposed to alleviate this issue. The proposed structure is extensively validated using well calibrated EM simulations across inductor geometries. Finally, measured result of spiral inductor with GSG padsets validate the merit of the proposed approach.
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