基于28nm的32Mb嵌入式闪存,具有最佳电池效率和稳健的设计成就,在0.85V下具有13.48Mb/mm2的性能

H. Shin, Sangkyung Won, Do-Hee Kim, Byung-Soon Choi, G.H. Kim, Myeonghee Oh, Jaeseung Choi, J. Kye
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引用次数: 0

摘要

本文提出的28nm嵌入式快闪记忆体,在实现最佳尺寸的同时,有效地提高记忆体运算效率。通过采用温度自动跟踪辅助电路和双向串并联转换(BSPC)电荷泵技术减小了外设尺寸,并通过采用源线浮动(SLF)技术提高传感裕度来实现每垫的最大密度,从而提高了IP尺寸。采用程序电流自动控制(PCAC)方案,提高了程序运行效率,减小了位单元的特性偏差。通过这些技术的应用,支持72位程序和144位读取操作,并基于32Mbit密度实现芯片尺寸2.367mm2。考虑到面积Mbit (13.48Mb/mm2)和Cell效率(68.1%),这具有最佳的竞争力。
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A 32Mb Embedded Flash Memory based on 28nm with the best Cell Efficiency and Robust Design achievement featuring 13.48Mb/mm2 at 0.85V
A 28nm embedded Flash memory presented in this paper maximizes memory operation efficiently while implementing an optimal size. The peripheral size was reduced by applying the temperature auto tracking assist circuit with Bidirectional and Series-Parallel Conversion (BSPC) charge pump technology, and the IP size was improved by implementing the maximum density per mat by enhancing the sensing margin using Source Line Floating (SLF) technology. Also, using Program Current Auto Control (PCAC) scheme, program operation efficiency was improved and characteristic deviation of bit cell was reduced. With the application of these technologies, 72 bits program and 144 bits read operation are supported, and chip size 2.367mm2 is implemented based on 32Mbit density. This has the best competitiveness considering the area Mbit (13.48Mb/mm2) and Cell efficiency (68.1%).
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