烧结银浆单搭接本构特性研究

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Pub Date : 2018-12-01 DOI:10.1109/EPTC.2018.8654407

X. Long, C. Du, Wenbin Tang, Yongchao Liu, Yao Yao, Fengrui Jia

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引用次数: 0

摘要

由于规模效应，烧结纳米银具有低温烧结和高温使用的优势。与其他焊料材料相比，烧结AgNP具有优越的导热性和导电性，有利于在高电流密度下的先进电子器件封装结构的应用。采用重叠面积为2.0 mm × 2.0 mm的单搭接试件对烧结AgNP的力学性能进行了量化，并进行了力学测试，获得了在10 ^{-3}/\ mathm {s}$至5 \ × 10 ^{-2} /$s不同剪切应变率下的剪切载荷-位移响应。破坏发生在烧结AgNP内部，而不是发生在AgNP与Au镀层之间的界面。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Constitutive Behaviour of Single Lap Joint of Sintered Silver Paste

Due to scale effect, sintered silver nanoparticles (AgNP) own the most appealing advantage of low temperature sintering and high temperature service. Compared with other solder materials, sintered AgNP has superior high thermal and electrical conductivities, which benefits the application of packaging structures subjected to high current density in advanced electronic devices. This study quantifies the mechanical properties of sintered AgNP using single lap joint specimens, which were prepared with an overlapped area of 2.0 mm $\times2.0$ mm and mechanically tested to obtain the shear load-displacement responses under different shear strain rates ranging from $10 ^{-3} /\mathrm{s}$ to $5 \times 10 ^{-2} /$s. The failure occurred within the sintered AgNP rather than the interface between AgNP and Au coating.

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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

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