50-60 GHz波导到LTCC上的微带转换，以实现集成的MMIC封装

2016 IEEE MTT-S International Microwave and RF Conference (IMaRC) Pub Date : 2016-12-01 DOI:10.1109/IMARC.2016.7939620

Kinjal Parmar, Shailendra Singh

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引用次数: 1

摘要

本文报道了50-60 GHz探针型波导在LTCC衬底上向微带过渡的设计，这是毫米波系统中集成MMIC密封封装的初步发展。在背靠背配置下，模拟回波损耗优于15 dB，插入损耗小于0.4 dB。在50-60 GHz范围内，测量到的插入损耗为1.2 ~ 1.8 dB，回波损耗为12 dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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50–60 GHz waveguide to microstrip transition on LTCC for enabling integrated MMIC packaging

This paper reports the design of 50–60 GHz probe type waveguide to microstrip transition on LTCC substrate, which acts as an initial development towards integrated MMIC hermetic packaging in millimeter-wave systems. The transition shows a simulated return loss better than 15 dB and insertion loss less than 0.4 dB in back to back configuration. The measured insertion loss is 1.2 to 1.8 dB with return loss bettering 12 dB in the range of 50–60 GHz.

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2016 IEEE MTT-S International Microwave and RF Conference (IMaRC)

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