片上噪声通信信道的精确系统宏模型

N. Terrassan, D. Bertozzi, A. Bogliolo
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引用次数: 4

摘要

随着纳米级技术的出现,即使是RTL和系统设计人员也必须考虑互连分析,以提供可预测的性能、可靠性和满足功耗预算。然而,使用传统电路模拟器(如SPICE)进行高速互连的系统范围建模可能会使CPU成本过高。我们建议建立捕获噪声效应的分析互连宏模型,并将其集成到SystemC通信抽象中。实验结果表明,HDL模拟的SPICE平均准确率为5%,而一些案例研究表明,所提出的框架适用于快速探索物理通道配置和性能估计。
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Spice-accurate systemC macromodels of noisy on-chip communication channels
With the advent of nanoscale technologies, even RTL and system designers must consider interconnect analysis to provide predictable performance, reliability and meet power budgets. However, system-wide modeling of high-speed interconnects using conventional circuit simulators such as SPICE can become prohibitively CPU expensive. We propose to formulate analytical interconnect macromodels capturing noise effects, and to integrate them into the SystemC communication abstractions. Experimental results show that HDL simulations achieve an average accuracy of 5% from SPICE, while a few case studies illustrate the applicability of the proposed framework for fast exploration of physical channel configuration and performance estimation.
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