平台拼接电容对高速差动链路非理想回路的影响

C. Lun, Yew Teong Guan, Yoon Chee Kheong, Fabian Kung Wai Lee, Wong Hin Yong, G. Vetharatnam
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引用次数: 0

摘要

讨论了平台拼接电容在非理想参考平面上促进高速差分链路信号返回路径的有效性。在本研究的最后,提出了拼接电容的平台设计准则。这项研究的结果被用于大幅减少平台拼接电容器的数量,从而为英特尔内部和外部客户赢得了重大设计胜利。按照此设计准则,预计节省成本约为1000万美元,如果推广到其他产品平台,并为未来的产品实施建立良好的方法,预计将节省更多的成本。研究表明,在非理想返回路径上,拼接电容既没有显著提高差分信号的完整性,也没有显著降低差分信号的完整性。拼接电容与非理想回路差动链路的频率特性无直接关系。在结束本研究之前,我们在Hspice中进行了时域分析,并在SATA和PCIe接口的实际系统板上进行了实验室测量。所有捕获的眼图结果在模拟和测量之间显示出相似的趋势。
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Platform stitching capacitors impact to high-speed differential links on non-ideal return path
This paper discusses the validity of platform stitching capacitors in facilitating high-speed differential links signal return path on non-ideal reference plane. A platform design guideline for the stitching capacitor is recommended at the end of this study. The results from this study were used to enable a huge reduction in the number of platform stitching capacitors, which scored major design wins to both Intel internal and external customers. The cost saving is estimated to be approximately $10M cost saving following this design guidelines, more cost saving are expected if proliferate to other product platforms and establish good method for future product implementation. Our study shows that stitching capacitors have neither significantly improve nor degrade differential signal integrity performance on non-ideal return path. There is no direct relationship between the stitching capacitors and the frequency characteristics of the differential links on non-ideal return path. Before concluding this study, we perform time-domain analysis in Hspice and lab measurement was taken on actual system board for SATA and PCIe interfaces. All the eye diagram results captured are showing similar trend between simulation and measurement.
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