Arjun Chaudhuri, Sanmitra Banerjee, K. Chakrabarty
{"title":"节点秩:单片三维集成电路故障定位的观察点插入","authors":"Arjun Chaudhuri, Sanmitra Banerjee, K. Chakrabarty","doi":"10.1109/ATS49688.2020.9301589","DOIUrl":null,"url":null,"abstract":"Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process variations. Tier-level fault localization is therefore essential for yield ramp-up and diagnosis. Due to overhead concerns, only a limited number of observation points (OPs) can be inserted on the outgoing inter-layer vias (ILVs) of a tier to enable fault localization. We propose the computationally efficient NodeRank algorithm for observation-point insertion (OPI) on a small subset of outgoing ILVs. An ATPG-independent heuristic is presented, which is several orders-of-magnitude faster than ATPG fault simulation-based OPI. We introduce a metric called degree of fault localization to quantify the effectiveness of OPs. Evaluation results for two-tier M3D benchmark circuits show the effectiveness of the proposed method.","PeriodicalId":220508,"journal":{"name":"2020 IEEE 29th Asian Test Symposium (ATS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"NodeRank: Observation-Point Insertion for Fault Localization in Monolithic 3D ICs∗\",\"authors\":\"Arjun Chaudhuri, Sanmitra Banerjee, K. Chakrabarty\",\"doi\":\"10.1109/ATS49688.2020.9301589\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process variations. Tier-level fault localization is therefore essential for yield ramp-up and diagnosis. Due to overhead concerns, only a limited number of observation points (OPs) can be inserted on the outgoing inter-layer vias (ILVs) of a tier to enable fault localization. We propose the computationally efficient NodeRank algorithm for observation-point insertion (OPI) on a small subset of outgoing ILVs. An ATPG-independent heuristic is presented, which is several orders-of-magnitude faster than ATPG fault simulation-based OPI. We introduce a metric called degree of fault localization to quantify the effectiveness of OPs. Evaluation results for two-tier M3D benchmark circuits show the effectiveness of the proposed method.\",\"PeriodicalId\":220508,\"journal\":{\"name\":\"2020 IEEE 29th Asian Test Symposium (ATS)\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-11-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 29th Asian Test Symposium (ATS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ATS49688.2020.9301589\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 29th Asian Test Symposium (ATS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS49688.2020.9301589","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
NodeRank: Observation-Point Insertion for Fault Localization in Monolithic 3D ICs∗
Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process variations. Tier-level fault localization is therefore essential for yield ramp-up and diagnosis. Due to overhead concerns, only a limited number of observation points (OPs) can be inserted on the outgoing inter-layer vias (ILVs) of a tier to enable fault localization. We propose the computationally efficient NodeRank algorithm for observation-point insertion (OPI) on a small subset of outgoing ILVs. An ATPG-independent heuristic is presented, which is several orders-of-magnitude faster than ATPG fault simulation-based OPI. We introduce a metric called degree of fault localization to quantify the effectiveness of OPs. Evaluation results for two-tier M3D benchmark circuits show the effectiveness of the proposed method.