节点秩:单片三维集成电路故障定位的观察点插入

Arjun Chaudhuri, Sanmitra Banerjee, K. Chakrabarty
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引用次数: 4

摘要

单片3D (M3D)集成电路已经成为一种有前途的技术,与传统的3D堆叠集成电路相比,它在功率、性能和面积(PPA)方面都有显着改善。然而,M3D层序组装和不成熟的制造工艺容易产生制造缺陷和层间工艺变化。因此,层级故障定位对于产量提升和诊断至关重要。出于开销的考虑,为了实现故障定位,只能在一层的出接口ilv上插入有限数量的观测点(op)。我们提出了一种计算效率很高的NodeRank算法,用于在一小部分出站ilv上进行观测点插入(OPI)。提出了一种与ATPG无关的启发式算法,该算法比基于ATPG故障仿真的OPI算法快几个数量级。我们引入了一个称为故障定位度的度量来量化OPs的有效性。对两层M3D基准电路的评估结果表明了该方法的有效性。
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NodeRank: Observation-Point Insertion for Fault Localization in Monolithic 3D ICs∗
Monolithic 3D (M3D) ICs have emerged as a promising technology with significant improvement in power, performance, and area (PPA) over conventional 3D-stacked ICs. However, the sequential assembly of M3D tiers and immature fabrication process are prone to manufacturing defects and intertier process variations. Tier-level fault localization is therefore essential for yield ramp-up and diagnosis. Due to overhead concerns, only a limited number of observation points (OPs) can be inserted on the outgoing inter-layer vias (ILVs) of a tier to enable fault localization. We propose the computationally efficient NodeRank algorithm for observation-point insertion (OPI) on a small subset of outgoing ILVs. An ATPG-independent heuristic is presented, which is several orders-of-magnitude faster than ATPG fault simulation-based OPI. We introduce a metric called degree of fault localization to quantify the effectiveness of OPs. Evaluation results for two-tier M3D benchmark circuits show the effectiveness of the proposed method.
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