自热多层垂直石墨烯纳米带互连的性能分析

B. Kumari, Rahul Kumar, Manodipan Sahoo, Rohit Sharma
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引用次数: 1

摘要

在本文中,我们报道了自加热氯化铁($FeCl_{3}$)掺杂顶部接触多层垂直石墨烯纳米带(TC-MLVGNR)互连的定性比较信号完整性分析,并与铜和$FeCl_{3}$掺杂顶部接触多层水平石墨烯纳米带(TC-MLHGNR)互连进行了比较。本研究采用耦合三线互连系统。互连尺寸按照7纳米技术节点的IRDS-2018路线图。在现实情况下,粗糙度存在于互连表面,并且在较低的技术节点上起主要作用。在制造过程中,粗糙度是不可避免的。它有助于提供介电和互连之间的附着力。因此,为了捕捉现实场景,我们正在考虑粗糙的多层石墨烯纳米带(MLGNR)互连与传统的粗糙铜互连进行比较。与粗铜、光滑铜和TC-MLHGNR互连相比,TC-MLHGNR互连的延迟分别降低了59%、51%和62%。即使考虑自热,其性能也比粗铜、光滑铜和TC-MLHGNR互连分别好26%、11%和54%。值得注意的是,粗糙tc - mlhgnr产生的延迟最高,特别是考虑到自热效应时。此外,本研究证明TC-MLVGNR互连在热效率方面优于TC-MLHGNR互连15%,从而使其成为超大规模技术节点的潜在互连候选者。
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Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects
In this paper, we report qualitative comparative signal integrity analysis of self-heated Ferric Chloride ($FeCl_{3}$) doped Top Contacted Multilayer Vertical Graphene Nanoribbon (TC-MLVGNR) interconnect and its comparison with copper and $FeCl_{3}$ doped Top Contacted Multilayer Horizontal Graphene Nanoribbon (TC-MLHGNR) interconnects. A coupled three-line interconnect system is utilized in this study. The dimensions of interconnects are taken as per the IRDS-2018 roadmap for 7nm technology node. In realistic scenario, roughness is present on interconnect surfaces and it plays a major role at lower technology nodes. Roughness is inevitable during the fabrication process. It helps to provide the adhesion between dielectric and interconnect. So to capture the realistic scenario, we are considering rough Multilayer Graphene Nanoribbon (MLGNR) interconnects to compare with conventional rough copper interconnects. When compared to rough copper, smooth copper and TC-MLHGNR interconnects, delay of TC-MLVGNR interconnect is reduced by 59%, 51% and 62%, respectively. Even if we consider self-heating, its performance is better than rough copper, smooth copper and TC-MLHGNR interconnects by 26%, 11% and 54%, respectively. It is worth noting that rough TC-MLHGNRs induce the highest delay especially when self-heating effect is considered. Also, this study proves that TC-MLVGNR interconnects outperform TC-MLHGNR interconnects in terms of thermal efficiency by 15% thus making it a potential interconnect candidate for ultra-scaled technology nodes.
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