{"title":"扭转对柔性互连的影响","authors":"E. Altinozen, A. Vukovic, P. Sewell","doi":"10.1109/fleps53764.2022.9781517","DOIUrl":null,"url":null,"abstract":"This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.","PeriodicalId":221424,"journal":{"name":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Torsion on Flexible Interconnects\",\"authors\":\"E. Altinozen, A. Vukovic, P. Sewell\",\"doi\":\"10.1109/fleps53764.2022.9781517\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.\",\"PeriodicalId\":221424,\"journal\":{\"name\":\"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"volume\":\"15 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-07-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/fleps53764.2022.9781517\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/fleps53764.2022.9781517","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.