扭转对柔性互连的影响

E. Altinozen, A. Vukovic, P. Sewell
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引用次数: 0

摘要

本文报告了一个计算模型,用于评估在PI衬底上制造的挠性互连的反射损失和传输,并暴露于扭转变形。模型中使用了真实的材料参数,包括介电损耗和金属损耗,这些参数是在PI衬底上制造的互连的典型参数。
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Impact of Torsion on Flexible Interconnects
This paper reports on a computational model that is used to assess the reflection loss and transmission of flexible interconnects fabricated on a PI substrate and exposed to torsion deformation. Realistic material parameters that include dielectric and metallic losses typical of interconnects fabricated on the PI substrate are used in the model.
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