芯片封装板系统的电热协同设计

C. Sohrmann, A. Heinig, Michael Dittrich, R. Jancke, P. Schneider
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引用次数: 2

摘要

我们提出了一种创新的热建模方法,考虑到不同的“知识水平”,因为它们在微电子系统的设计阶段变得可用。有许多工具可用于热模拟,非常适合高精度建模。然而,如果CAD模型不可用或建模时间有限,它们的适用性将严重降低。特别是对于电热协同设计,在建模和仿真之间需要几个旋转,建模时间很快就会变得非常大。通过不同技术的组合,我们的解决方案提供快速直观的建模,连续添加细节,非常短的仿真时间和开放的接口。在本文中,我们提出了一种基于构造立体几何(CSG)的热建模方法。我们讨论了该解决方案的优点和局限性,并在一个与工业相关的复杂性示例上演示了其性能。
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Electro-thermal co-design of chip-package-board systems
We propose an innovative thermal modeling approach that takes into account different “levels-of-knowledge” as they become available during the design phases of microelectronic systems. There are many tools available for thermal simulations which are well-suited for high-precision modeling. However, their applicability severely diminishes if CAD models are not available or modeling time is limited. Especially for electro-thermal co-design, where several spins between modeling and simulation are required, modeling time quickly becomes prohibitively large. By a combination of different techniques our solution offers fast and intuitive modeling, continuous addition of detail, very short simulation times, and open interfaces. In this paper we present our thermal modeling approach based on constructive solid geometry (CSG). We discuss advantages and limits of this solution and demonstrate its performance on an example of industrially-relevant complexity.
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