1000°C下的电子学

D. Maier, M. Alomari, N. Grandjean, J. Carlin, M. diForte-Poisson, C. Dua, S. Delage, E. Kohn
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引用次数: 2

摘要

到目前为止,高温电子学基本上局限于大约。500℃高温下性能优异的有源半导体元件多以SiC为基础[1]。因此,在更高温度下的传感主要依赖于非半导体元件,从根本上限制了系统的复杂性。然而,近年来iii -氮化物异质结构,即晶格匹配的InAlN/GaN异质结构已成为一种替代方法。在2006年的初步概念验证实验中[2],可以在短时间内证明1000°C的操作。
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Towards electronics at 1000 °C
High temperature electronics is up to now essentially limited to approx. 500 °C by the high temperature properties of the active semiconductor elements mostly based on SiC [1]. Sensing at even higher temperature relies therefore mostly on non-semiconductor components essentially limiting the systems complexities. However in recent years III-Nitride heterostructures, namely lattice matched InAlN/GaN heterostructures, have become an alternative. In an initial proof-of-concept experiment in 2006 [2] 1000 °C operation could be demonstrated for a short period of time.
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