用于超高密度封装和3D电路集成的陶瓷中间体

A. Adibi, A. Isapour, Mohsen Niayesh, A. Kouki
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引用次数: 1

摘要

5G技术和物联网(IoT)的到来刺激了更高的数据速度,加速了对更短互连的电路集成的需求。采用带有硅通孔(tsv)的硅中间层的3D集成和封装技术已经成为实现这一趋势的关键技术之一。本文提出并论证了一种基于低温共烧陶瓷(LTCC)技术的低成本硅中间体替代方案。利用超薄陶瓷层和激光烧蚀技术,成功实现了直径仅为$20 \mu \ mathm {m}$、间距仅为$40 \mu \ mathm {m}$的微通孔陶瓷中间体。除了独立的中间体外,开发的制造工艺已用于设计用于集成硅光子(SiP)和电子芯片的高密度封装,其操作带宽高达48 GHz。这种新颖的具有成本效益的封装技术为在单个封装中集成多芯片高速电子系统提供了一种可行的替代方案,具有高可靠性和非常好的性能,以保持信号完整性。
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Ceramic Interposers for Ultra-High Density Packaging and 3D Circuit Integration
Higher data speeds spurred on by the arrival of 5G technology and the Internet of Things (IoT) have accelerated the need for increased circuit integration with shorter interconnects. 3D integration and packaging techniques that employ silicon interposers with Through Silicon Vias (TSVs) have emerged as one of the key technologies in enabling this trend. In this paper, a cost-effective alternative to silicon interposers based on Low Temperature Co-fired Ceramic (LTCC) technology is proposed and demonstrated. Using ultra-thin ceramic layers and laser ablation, ceramic interposers with micro-via holes as small as $20 \mu \mathrm{m}$ in diameter and $40 \mu \mathrm{m}$ pitch have been successfully realized. In addition to the standalone interposers, the developed fabrication process has been used to design a high-density package for the integration of Silicon Photonic (SiP) and electronic chips with operational bandwidth up to 48 GHz. This novel cost-effective packaging technology offers a viable alternative to silicon interposers for the integration of multi-chip high-speed electronic systems in a single package with high reliability and very good performance to maintain signal integrity.
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