M. Modreanu, P. Cosmin, S. Cosmin, C. Cobianu, C. Dunare
{"title":"样品称重法测量CVD薄膜厚度","authors":"M. Modreanu, P. Cosmin, S. Cosmin, C. Cobianu, C. Dunare","doi":"10.1109/SMICND.1996.557407","DOIUrl":null,"url":null,"abstract":"Several type of films obtained by the Chemical Vapour Deposition technique, such as silicon dioxide, phosphosilicate glass, silicon oxynitride, silicon nitride and polysilicon, were investigated. A calibration technique for the sample weighing method comprising film density evaluation was developed. The sample weighing method was found to be a fast, precise and non-destructive method for thin film thickness evaluation.","PeriodicalId":266178,"journal":{"name":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","volume":"80 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Measurement of CVD thin films thickness by sample weighing method\",\"authors\":\"M. Modreanu, P. Cosmin, S. Cosmin, C. Cobianu, C. Dunare\",\"doi\":\"10.1109/SMICND.1996.557407\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Several type of films obtained by the Chemical Vapour Deposition technique, such as silicon dioxide, phosphosilicate glass, silicon oxynitride, silicon nitride and polysilicon, were investigated. A calibration technique for the sample weighing method comprising film density evaluation was developed. The sample weighing method was found to be a fast, precise and non-destructive method for thin film thickness evaluation.\",\"PeriodicalId\":266178,\"journal\":{\"name\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"volume\":\"80 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.1996.557407\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 International Semiconductor Conference. 19th Edition. CAS'96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.1996.557407","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Measurement of CVD thin films thickness by sample weighing method
Several type of films obtained by the Chemical Vapour Deposition technique, such as silicon dioxide, phosphosilicate glass, silicon oxynitride, silicon nitride and polysilicon, were investigated. A calibration technique for the sample weighing method comprising film density evaluation was developed. The sample weighing method was found to be a fast, precise and non-destructive method for thin film thickness evaluation.
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