{"title":"热冲击和热NF/sub - 3/原位炉清洗","authors":"B. Metteer","doi":"10.1109/ASMC.1995.484378","DOIUrl":null,"url":null,"abstract":"Initial results from SEMATECH and SEMATECH sponsored research indicate great promise for successful commercial thermal shock and thermal NF/sub 3/ in-situ cleaning of furnace process chambers. Use of the technologies on standard diffusion furnaces is highly flexible depending on a production facility's current capacity and process conditions. Research at SEMATECH aimed at optimizing both methodologies will continue into 1996 with all data being completely accessible to SEMATECH member companies.","PeriodicalId":237741,"journal":{"name":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","volume":"27 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Thermal shock and thermal NF/sub 3/ in-situ furnace cleaning\",\"authors\":\"B. Metteer\",\"doi\":\"10.1109/ASMC.1995.484378\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Initial results from SEMATECH and SEMATECH sponsored research indicate great promise for successful commercial thermal shock and thermal NF/sub 3/ in-situ cleaning of furnace process chambers. Use of the technologies on standard diffusion furnaces is highly flexible depending on a production facility's current capacity and process conditions. Research at SEMATECH aimed at optimizing both methodologies will continue into 1996 with all data being completely accessible to SEMATECH member companies.\",\"PeriodicalId\":237741,\"journal\":{\"name\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"volume\":\"27 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-11-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1995.484378\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of SEMI Advanced Semiconductor Manufacturing Conference and Workshop","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1995.484378","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal shock and thermal NF/sub 3/ in-situ furnace cleaning
Initial results from SEMATECH and SEMATECH sponsored research indicate great promise for successful commercial thermal shock and thermal NF/sub 3/ in-situ cleaning of furnace process chambers. Use of the technologies on standard diffusion furnaces is highly flexible depending on a production facility's current capacity and process conditions. Research at SEMATECH aimed at optimizing both methodologies will continue into 1996 with all data being completely accessible to SEMATECH member companies.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
