下一代DDR5先进飞传路由的包传播时延依赖

Vinod Arjun Huddar, Shinyoun Park
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引用次数: 0

摘要

封装信号传输延迟是DDR5等高速设计的重要参数。封装延迟和PCB延迟决定了DDR5接口运行在4.0 Gbps及以上的数据速率。从DDR3(第三代DDR)开始,菊花链路由已经被广泛使用,因为它可以通过提供更小的跟踪存根和电容负载来支持高数据速率操作。即便如此,超过一定数量的加载,fly-by在保持高数据速率方面开始出现问题。限制飞越的因素之一是包裹延迟。为了解决飞通拓扑的种种局限性,引入了高级飞通拓扑路由。讨论了高级飞通对DRAM封装延迟的依赖性。
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Package Propagation Delay Dependency of Advanced Fly-By Routing For Next Generation DDR5
Package signal transit delay is an important parameter for high-speed designs like DDR5. Package delay along with PCB delay dictates the data rates of DDR5 interface running at 4.0 Gbps and beyond. From DDR3 (third generation DDR) onwards, daisy chain routing has been widely used as it can support high data rate operations by providing smaller trace stubs and capacitive loadings. Even so, beyond a certain number of loadings, the fly-by starts to have trouble in keeping up with high data rates. One of the limiting factors for fly-by is package delay. To address various limitations of fly-by topology, advanced fly-by topology routing was introduced. Dependency on DRAM package delay for advanced fly-by is discussed in this paper.
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