低抖动混合模式系统多层封装和PCB分电源/地平面的隔声方法分析

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250031

Y. Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, Joungho Kim

{"title":"低抖动混合模式系统多层封装和PCB分电源/地平面的隔声方法分析","authors":"Y. Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, Joungho Kim","doi":"10.1109/EPEP.2003.1250031","DOIUrl":null,"url":null,"abstract":"Various noise isolation methods for low jitter on the power/ground plane are thoroughly analyzed and a new method is proposed. We analyzed using both frequency and time domain measurement methods and the results were verified by jitter measurements.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system\",\"authors\":\"Y. Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, Joungho Kim\",\"doi\":\"10.1109/EPEP.2003.1250031\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Various noise isolation methods for low jitter on the power/ground plane are thoroughly analyzed and a new method is proposed. We analyzed using both frequency and time domain measurement methods and the results were verified by jitter measurements.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"119 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250031\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250031","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 5

摘要

深入分析了功率/地平面低抖动的各种噪声隔离方法，提出了一种新的隔离方法。我们使用频域和时域测量方法进行分析，并通过抖动测量验证了结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Various noise isolation methods for low jitter on the power/ground plane are thoroughly analyzed and a new method is proposed. We analyzed using both frequency and time domain measurement methods and the results were verified by jitter measurements.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

自引率

0.00%

发文量

期刊最新文献

Modeling of non-ideal planes in stripline structures Generation of passive macromodels from transient port responses Power distribution analysis methodology for a multi-gigabit I/O interface Enforcing passivity for rational function based macromodels of tabulated data Laminate package trends for high-speed system interconnects