大电网热敏感红外降分析

Yu Zhong, Martin D. F. Wong
{"title":"大电网热敏感红外降分析","authors":"Yu Zhong, Martin D. F. Wong","doi":"10.1109/ISQED.2008.57","DOIUrl":null,"url":null,"abstract":"Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.","PeriodicalId":243121,"journal":{"name":"9th International Symposium on Quality Electronic Design (isqed 2008)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-03-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":"{\"title\":\"Thermal-Aware IR Drop Analysis in Large Power Grid\",\"authors\":\"Yu Zhong, Martin D. F. Wong\",\"doi\":\"10.1109/ISQED.2008.57\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.\",\"PeriodicalId\":243121,\"journal\":{\"name\":\"9th International Symposium on Quality Electronic Design (isqed 2008)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-03-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"29\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"9th International Symposium on Quality Electronic Design (isqed 2008)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2008.57\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"9th International Symposium on Quality Electronic Design (isqed 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2008.57","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 29

摘要

由于电网焦耳加热与电阻率的线性温度依赖之间存在正反馈回路,因此高性能集成电路中电网温度分布的不均匀会影响电网的红外降。缺乏对电网红外降热效应的准确评估可能导致过度设计;或者更糟的是,低估了由于局部温度升高而导致的IR下降。本文提出了一种快速计算电网温度相关红外降的方法。我们提出了一种新的热学模型和数学公式来有效地计算电网上的温度分布。传统的热集总模型给出的热网络比原始电网大得多(节点多20倍),与之相比,我们的模型利用了电网的特性,并显著减小了热等效网络的规模(仅为电网规模的13%)。采用迭代方法[16],基于新的温度分布有效地更新红外降。实验结果表明,在不考虑温度影响的情况下,最坏的红外跌落分析误差可达10%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Thermal-Aware IR Drop Analysis in Large Power Grid
Due to the positive feedback loop between power grid Joule heating and the linear temperature dependence of resistivity, non-uniform temperature profiles on the power grid in high-performance IC influence the IR drop in the power grid. Lack of accurate evaluation of thermal effect on the IR drop in the power grid may lead to over-design; or worse, underestimates the IR drop due to increased local temperature. This paper presents a method to compute the temperature-dependent IR drop on the power grid extremely fast. We propose a novel thermal model and a mathematical formulation to compute the temperature profiles on the power grid efficiently. Compared to the traditional thermal lumped model, which gives a much larger thermal network than the original power grid (20 times more nodes), our model takes advantage of power grid properties, and reduces the size of the thermal equivalent network dramatically (only 13% of the size of the power grid). Iterative methods [16] are used to efficiently update the IR drops based on the new temperature profile. Experimental results show that without considering temperature impact, the worst IR drop analysis can have error up to 10%.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A Low Energy Two-Step Successive Approximation Algorithm for ADC Design Robust Analog Design for Automotive Applications by Design Centering with Safe Operating Areas Characterization of Standard Cells for Intra-Cell Mismatch Variations Noise Interaction Between Power Distribution Grids and Substrate Error-Tolerant SRAM Design for Ultra-Low Power Standby Operation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1