在光学应用中使用Hf薄膜与氧化物衬底的晶圆原子扩散键合

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598448

G. Yonezawa, M. Uomoto, T. Shimatsu

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引用次数: 0

摘要

利用Hf薄膜与氧化物衬底进行原子扩散键合，可获得100%透光率的界面，键合界面表面自由能大于2 J/m2，可用于高光子能量的光学应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Atomic Diffusion Bonding of Wafers with Oxide Underlayers using Thin Hf Films for Optical Applications

Atomic diffusion bonding of wafers with oxide underlayers using Hf films produces an interface with 100% light transmittance and large surface free energy at the bonded interface greater than 2 J/m2, which is useful for optical applications with high photon energy.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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